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1
plasma etching processes for interconnect realization in vlsi
etching
plasma
porous
sioch
dielectric
figure
etch
processes
interconnect
materials
porosity
fluorocarbon
layer
surface
realization
technology
vlsi
films
formation
interconnects
rate
journal
plasmas
species
chemistry
deposition
fluorine
approach
diffusion
metallic
temperature
chemical
thickness
barrier
induced
polymerizing
step
vacuum
opening
reducing
removal
void
addition
dielectrics
organic
wiggling
composition
deposited
impact
increase
Jezik:
chinese
Fajl:
PDF, 16.36 MB
Vaši tagovi:
0
/
0
chinese
2
Plasma Etching Processes for Interconnect Realization in VLSI
Elsevier
Nicolas Posseme
etching
plasma
porous
dielectric
sioch
figure
etch
processes
interconnect
materials
fluorocarbon
porosity
layer
surface
technology
realization
vlsi
films
interconnects
rate
formation
journal
plasmas
species
chemistry
approach
fluorine
deposition
temperature
metallic
thickness
diffusion
chemical
step
barrier
impact
induced
polymerizing
vacuum
addition
cf4
dielectrics
reducing
deposited
opening
organic
shown
sio2
density
hydrogen
Godina:
2015
Jezik:
english
Fajl:
PDF, 4.31 MB
Vaši tagovi:
0
/
0
english, 2015
3
Plasma Etching Processes for Interconnect Realization in VLSI
Elsevier
Nicolas Posseme
etching
plasma
porous
dielectric
sioch
figure
etch
processes
interconnect
materials
fluorocarbon
porosity
layer
surface
technology
realization
vlsi
films
rate
interconnects
formation
journal
plasmas
species
chemistry
fluorine
approach
deposition
temperature
thickness
diffusion
metallic
chemical
step
impact
induced
polymerizing
vacuum
addition
barrier
cf4
deposited
reducing
shown
sio2
density
dielectrics
hydrogen
composition
increase
Godina:
2015
Jezik:
english
Fajl:
PDF, 12.75 MB
Vaši tagovi:
0
/
0
english, 2015
1
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